Tecnologies per llicenciar

Description

Current organ-on-chip platforms, microphysiological systems, and tissue engineering bioreactors rely on rigid or semi-rigid device architectures fabricated from materials such as glass, polystyrene, or structured PDMS. These systems are typically assembled using irreversible bonding, adhesive layers, or mechanical fixation strategies that require device sealing prior to biological loading.

Existing enclosure and sealing approaches have become a critical limitation as the field shifts toward softer, mechanically compliant culture systems that better replicate native tissue environments. Current solutions do not support wet loading, post-loading encapsulation of biological constructs, or fully deformable device architectures, limiting the development of mechanically active in vitro models for tissue maturation, mechanobiology, and organ-on-chip applications.

ELYSO offers significant advantages in biological compatibility and device integration. Because sealing is achieved without adhesives, mechanical compression, or elevated temperatures, sensitive cells, organoids, hydrogels, and tissue constructs can be encapsulated under wet and sterile conditions with minimal handling.

The monolithic elastomeric enclosure maintains fluidic integrity during bending, stretching, and compression, reducing the risk of leakage and seal failure associated with multi-component assemblies. By eliminating rigid holders, fasteners, and planar bonding requirements, ELYSO enables mechanically compliant bioreactors with unprecedented design freedom for mechanobiology, dynamic tissue maturation, organ-on-chip, and biohybrid systems.

Current stage of development

TRL 4 – Laboratory-validated prototype Application-specific validation ongoing.